USERS' GUIDE

HD-000335-UG-1- HB-Bipolar-DS-eval-board

 

HEY-HBDS-G-12K1-A USERS'GUIDE

HEY1011 HALF BRIDGE BIPOLAR DRIVER SWITCH BOARD

 

Content

DescriptionQuick Start Guide - Default SettingsGate pull up and pull down resistors - 3V3 LDO For Logic Circuits - HEY1011-L12 Under Voltage Lockout - Input PWM Circuit - Enable and start sequenceMeasurement pointsBipolar Gate drivePropagation delayDouble Pulse TestDouble pulse test resultsSchematicPCB LayoutBill of materialsOrdering InformationDisclaimer

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Description

The Heyday Integrated Circuits Half Bridge Driver-Switch HEY-HBDS-G-12D1-D is a demonstration board containing two HEY1011-L12 GaN FET drivers and two GaN FETs configured in a half bridge configuration.

The datasheet for the HEY1011-L12 used in this board can be found here.

Fig1- HEY-HBDS-G-12K1-A Evaluation Board

Figure 1: HEY-HBDS-G-12K1-A Evaluation Board

 

The HEY-HBDS-G-12D1-D can be used to perform double pulse tests, or to interface the half bridge to an existing LC power section, both as shown below.

 The isolated HEY1011-L12 driver does not require secondary side power or bootstrap components. Gate drive power is supplied to secondary side from the primary side supply voltage VDRV. The amplitude of the gate drive can be varied by varying VDRV between 7 V and 13.2 V.

 


 

 

hazard

 

DANGER

DO NOT TOUCH THE BOARD WHEN IT IS ENERGIZED AND ALLOW ALL COMPONENTS TO DISCHARGE COMPLETELY PRIOR HANDLING THE BOARD.

 HIGH VOLTAGE CAN BE EXPOSED ON THE BOARD WHEN IT IS CONNECTED TO POWER SOURCE. EVEN BRIEF CONTACT DURING OPERATION MAY RESULT IN SEVERE INJURY OR DEATH.

Please ensure that appropriate safety procedures are followed. This evaluation kit is designed for engineering evaluation in a controlled lab environment and should be handled by qualified personnel ONLY. Never leave the board operating unattended.

warning

 

WARNING

Some components can be hot during and after operation. There is NO built-in electrical or thermal protection on this evaluation kit. The operating voltage, current, and component temperature should be monitored closely during operation to prevent device damage.

ESD

 

CAUTION

This product contains parts that are susceptible to damage by electrostatic discharge (ESD). Always follow ESD prevention procedures when handling the product. 

 

Quick Start Guide

 

Fig2-HEY-HBDS-G-12K1-A Quick Start

 

Figure 2: HEY-HBDS-G-12K1-A Quick Start

  1. Ensure the drivers are enabled. See section Enable and start sequence for details.
  2. Apply VDRV = 12V

  3. Apply input gate signals, with adequate dead time, to the IN_L and IN_H inputs. See section Input PWM circuit below for details.
  4. Convenient test points a located on the test board – see section Measurement points. A suitable differential oscilloscope should be used to monitor the high side gate signal from VGH to VSW.

     

Default Settings

The HEY-HBDS-G-12K1-A EVM is supplied with the following default settings:

Value Default Comment
Gate resistors RPU = 10 R, RPD = 1R See section Gate pull up and pull down resistors
SEL UVLO = 10 V See section Hey1011-L12 Under Voltage Lockout
EN Pull up to VDRV See section Enable and start sequence
PWM IN HS_EXT, LS_EXT See section Input PWM circuit
VDD_LOGIC External supply See section 3V3 LDO for logic circuit

 

Gate pull up and pull down resistors

The HEY1011-L12 gate driver has independent output pins for the gate pull up and gate pull down allowing control of the turn-on and turn-off rise and fall times.

The default values for these resistors are:

  • OUTPU: R1 and R5 = 10 Ohms

  • OUTPD: R3 and R7 = 1 Ohm

These values can be modified to suit your own application.

 

3V3 LDO for logic circuits

The HEY-HBDS-G-12K1-A EVM contains an on-board LDO regulator to generate a 3.3 V. This 3V3 supply is used for the deadtime circuit and can also be used for EN pull up.

The input supply, VDD_LOGIC, is supplied through pin 2 of connector CONN1. This can be a separate external DC supply or can be linked to the driver supply, VDRV, at CONN1

 

Fig3- 3V3 LDO Circuit

Figure 3: 3V3 LDO Circuit

 

HEY1011-L12 Under Voltage Lockout

The SEL pin of the HEY1011-L12 drivers selects the under-voltage lock-out level for the VDRV supply. This is done by connecting the SEL pin to GND or VDRV to select the desired nominal UVLO level. Tying SEL pin to GND selects the UVLO = 6.6V while tying SEL pin to VDRV selects the UVLO = 10V (the default setting on the HEY-HBDS-G-12K1-A EVM).

 

Fig4- HEY1011-L12 UVLO Setting

Figure 4:HEY1011-L12 UVLO Setting

 

Input PWM Circuit

The HEY-HBDS-G-12K1-A EVM contains an on-board circuit to generate a deadtime between the high side and low side gate drive signals from a single external signal generator.

This option is selected by setting the connector CONN8 jumpers to HS_INT and LS_INT. The deadtime between the high side and low side can be adjusted with the variable resistors R16 and R17 and the minimum deadtime is set with resistors R18 and R19.

Alternatively, the input PWM signals can be supplied externally direct from two signal generator channels and the internal deadtime circuit is bypassed by selecting HS_EXT and LS_EXT on connector CONN8.

 

Fig5a- Input signal deadtime circuitFig5b- Input signal deadtime circuit

Figure 5: Input signal deadtime circuit

 

Enable and start sequence

The HEY1011-L12 has an open drain enable pin (EN) to facilitate a system level wired-AND start up.

When the enable pin is externally pulled low this forces the driver into a low power mode. The driver output is pulled low in this mode. In the event of an internal fault condition, such as UVLO, this pin is actively pulled low internally by the driver. During normal operation, the pin is released by the driver, and must be pulled up with an external pull-up resistor. This functionality can be used by the PWM controller as an indication that it can start sending IN pulses to the driver. It is typically wired AND with the controller enable pin as shown in Figure 7 below.

The HEY-HBDS-G-12K1-A EVM board provides direct access to the EN pin on connector CONN1.

The EVM also contains, on connector CONN 5, options for pulling the EN pin to VDRV, an internal 3.3 V or an external EN_PU supply rail on CONN1. The EN_PU option can be used to use an external DC source or external system voltage, to pull up the EN pin.

The fourth option on connector CONN5 ties EN to GND and disables both drivers

fig6

Figure 6: Enable pull up options

Internally the board contains a 10k pull up resistor connected to the EN pin. If the EN pin is left floating, the drivers will not respond to INL or INH input signals.

HEY-HBDS-G-12D1-D-fig3

Figure 7: HEY1011-L12 Wired-AND enable

The start up sequence of the HEY1011-L12 is shown in Figure 8 below. Time TSTART is defined as the time after which VDRV reaches the UVLO rising level to the HEY1011-L12 releasing the EN internal pull down.

 IMPORTANT the IN signal must not be applied before the EN pin has been released.

 

HEY-HBDS-G-12D1-D-fig4

Figure 8: HEY1011-L12 Start up sequence.

 

Typical Enable/Disable

When disabling the HEY1011, the output gate drive is terminated synchronous to the EN signal falling edge as shown in Figure 9 (left) below.

When the driver is enabled, the output gate is synchronous to the first rising edge of the IN signal that occurs after the secondary VSEC UVLO level is reached as shown in Figure 9 (right) below.

 

fig9a

 

 

fig9b

 

CH1 (Red): Enable
CH2 (Grn): Low side switch VGS
CH3 (Blk): PWM Input
CH1 (Red): Enable
CH2 (Grn): Low side switch VGS
CH3 (Blk): PWM Input
Disable Enable

Figure 9: Typical Driver disable and enable

 

Measurement points

 

The HEY-HBDS-G-12K1-A EVM contains convenient test points for monitoring the high and low side gate drives as well as the switch node as shown in Figure 10 below.

When measuring VGS_H use a differential probe with suitable ratings for the applied bus voltage. The HEY-HBDS-G-12K1-A EVM uses a bipolar gate drive arrangement as shown in Bipolar Gate Drive below. When measuring VGS, both gate drives are measured relative to the source of their associated GaN FET. Therefore, the off-state voltage will be negative. See section Bipolar Gate Drive for further details.

It is important to use a low inductance scope probe ground lead as shown to avoid pickup of spurious switching noise.

Fig10a low inductance scope measurement.  Fig10- Measurement test points

Figure 10: Measurement points

warning CAUTION:
Many of the test signals have different reference voltages. It is important that these are not short circuited through the oscilloscope ground leads or external test equipment

 

 

Bipolar Gate Drive

Due to the high rate of change of voltages and currents in power switching circuits, unwanted inductor currents and capacitor voltage drops can be created.

One such example is the false turn on of a FET due to a dv/dt event. In a half bridge circuit, after the low side FET has been turned off and a suitable dead-time elapsed, the high side FET is turned on. This produces a rapidly changing switch node voltage at the drain of the low side FET. This voltage will produce a capacitor current:

formulae

flowing in the gate-drain capacitance, CGD, and driver output. It will cause the voltage on the gate of the low side FET to rise. If this voltage spike peaks beyond the threshold voltage VTH, the FET will conduct. Considering that the high side FET is also conducting, this can result in a potentially destructive shoot-through event.

The HEY-HBDS-G-12K1-A EVM uses a bipolar gate drive arrangement which is useful to mitigate against the effects of gate-drain capacitor currents. The secondary supply voltage VSEC is a function of the primary supply voltage VDRV. The zener diode, CR1, will regulate the positive turn on voltage of the GaN FET. During the turn-off of period, the gate voltage will be negative with a value of:

VGS_OFF = VSEC – VZENER. VSEC is typically 8 V when VDRV = 12 V and CLOAD = 1 nF.

 This negative VGS_OFF voltage allows more margin before the threshold voltage can be reached.

 Fig11- Bi-polar gate drive schematic

Figure 11: Bi-polar gate drive schematic

 

Propagation Delay

 

  • VDRV = 12V
  • Input = 100kHz
  • RPU = 10R, RPD = 1R
  • Power train un-loaded. That is, VHV+ = 0V.

Low side driver output
fig12a

 

CH1 (Red): Low side driver input
CH2 (Grn): Low side switch VGS

Typical Turn-on Propagation Delay
fig12b

 

CH1 (Red): Low side driver input
CH2 (Grn): Low side switch VGS

Typical Turn-off Propagation Delay
fig12c

 

CH1 (Red): Low side driver input
CH2 (Grn): Low side switch VGS

Figure 12: Typical Driver output at 100kHz

Double Pulse Test

 

The double pulse test is used to evaluate the switching characteristics of a power switch under hard switching but in a safe manner.

For a low side switch the set up is as shown below:

HEY-HBDS-G-12D1-D-fig8

Figure 13: Double Pulse Test

 

The low side switch is driven with two pulses as shown below. The high side switch can be held off or driven with the inverse of the low side gate switch (with adequate dead time).

HEY-HBDS-G-12D1-D-fig9

Figure 14: Double Pulse Test Waveforms

 

An inductor is placed in parallel with the high side switch. The goal of this inductor is to establish the test level current in the low side switch at the end of the first on pulse (1). The magnitude of the test level current at the end of period 1 is given by:

formulae2

During period 2, the inductor current will naturally decay. The duration of period 2 should not be too long that inductor current deviates significantly from the desired test level.

During period 3, the inductor current will again rise. Period 3 should not be so long that the inductor current rises to an excessive level.

The falling edge of pulse 1 is used to examine the hard turn off characteristics of the switch. The rising edge of pulse 3 is used to examine the hard turn on characteristics of the switch. By only applying these two pulses, the switches are only on for a very short time and should not overheat.

 

Double Pulse Test Results

 

 COMPONENTS

Drivers:

Heyday HEY1011-L12

Inductor:

100uH Air Core

RPU:

10Ω

RPD:

1Ω

 

DPT Result 100V – 10A

 

DPT Overview

 

fig15a

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard turn off

 

fig15b

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard turn on

 

fig15c

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Figure 15: DPT 100V – 10A

 

 

DPT Result 200V – 19A

 

DPT Overview

 

fig16a

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard turn off

 

fig16b

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard turn on

 

fig16c

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Figure 16: DPT 200V – 19A

 

 

DPT Result 450V – 58A

 

DPT Overview

 

fig17a

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard Turn Off

 

fig17b

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Hard Turn On

 

fig17c

 

CH2 (Grn): Low side Vgs (1GHz BW)
CH3 (Blk): Switch Node (500MHz BW)
CH4 (Blu): Inductor Current (1A/V)

Figure 17: DPT 450V – 58A

 

 

Schematic

 

fig18a
 
fig18b
 
fig18c
 
fig18d
 

Figure 18: HEY-HBDS-G-12K1-A Schematic

 

 

PCB Layout

HEY-HBDS-G-12K1-A

 

fig19

Figure 19: HEY-HBDS-G-12K1-A Component placement

 

  fig20b  fig20a  
 
 
 
Figure 20: HEY-HBDS-G-12K1-A Top Side Copper (L) and Layer 2 Copper (R)
fig21a Figure 21: HEY-HBDS-G-12K1-A Layer 3 Copper(L) and Bottom Side Copper (R)fig21b

 

 

 

 

Figure 21: HEY-HBDS-G-12K1-A Layer 3 Copper(L) and Bottom Side Copper (R)

 

 

 

 

 

Bill of materials

 

Item

Ref Name

Description

Value

Qty

Manufacturer

Manufacturer PN

1

C1, C2

CAP CERALINK, 1uF,500V PLZT

1uF

2

TDK

B58031U5105M062

2

C11, C12,C21,C22

CAP, CER,0.1uF,25V, X7R, S0603

0.1uF

4

KEMET

C0603C104K3RACTU

3

C14,C15,C16,C17

CAP, CER,100nF,16V,X7R, S0402

100nF

4

KEMET

C0402C104K4RALTU

4

C18,C19,C20,C23

CAP, CER,1uF,16V, X7R, S0603

1uF

4

WURTH ELEKTRONIK

885012206052

3

C3,C4

CAP, CER, 75pF,50V, NP0, S0402

75pF

2

MULTICOMP PRO

MC0402N750J500CT

6

C5,C7

CAP 2.2uF 630V PP FILM C12X26

2.2uF

2

PANASONIC

ECWFE2J225K

7

C6,C13

CAP, CER,1uF,25V, X5R, S0402

1uF

2

MURATA

GRM155R61E105KA12D

8

C9, C10

CAP, CER, 820pF,50V, X7R, S0603

820pF

2

MULTICOMP PRO

MC0603B821K500CT

9

CONN1

CONN, SCREW TERM, 5WAY

5WAY, SCREW TERM

1

PHOENIX CONTACT

MPT 0,5/ 5-2,54

10

CONN2, CONN3,

CONN4

CONN, PWR, M5, PTH

M5 SCREW TERM

3

KEYSTONE

7808

11

CONN6

CONN, HDR, 2WAY, 2P54

HDR, 2Way, 2.54mm

1

HARWIN

M20-9730246

12

CONN7, CONN9

SMA CONNECTOR EDGE (1.6mm PCB)

SMA EDGE

2

AMPHENOL RF

132322

13

CONN8, CONN5

CONN, HDR, 8WAY, 2P54

8WAY, 2P54, VERT

2

HARWIN

M20-9980446

14

CR1,CR2

DIO ZEN, 6V2, 100mW, 2%, SOD923

CDZVT2R6.2B

2

ROHM

CDZVT2R6.2B

15

IC1,IC2

HEY1011 7.66 X10 MODULE

HEY1011-L12

2

HEYDAY IC

HEY1011-L12

16

IC3,IC4,IC5,IC6

IC, 2 INPUT XOR, SC70, NC7SV86

NC7SV86

4

ON SEMI

NC7SV86P5X

17

IC7

MCP1799, 5V, 80mA LDO SOT23

MIC5203 3V3 80mA LDO

1

MICROCHIP

MIC5203-3.3YM5-TR

18

Q1,Q2

NGAN GS66516B 650V 60A

GS66516B

2

GAN SYSTEMS

GS66516B-MR

19

R1,R5

RES, SMD, 10R, 0.250W, 1%, S0603, ANTI SURGE

10R

2

BOURNS

CMP0603AFX-10R0ELF

20

R10, R12

RES, SMD, NA, 1%, S0402

NA

2

 

 

21

R11, R13

RES, SMD, 3K6, 0.063W, 1%, S0402

3.6K

2

TE CONNECTIVITY

CRG0402F3K6

22

R14, R15,R18,R19

RES, SMD, 100R, 0.063W, 1%, S0603

100R

4

MULTICOMP PRO

MCWR06X101 JTL

23

R16, R17

RES_VAR, 1K, SMT, 5mm, 1Turn

1K

2

VISHAY

TS53YJ102MR10

24

R2

RES, SMD, 10K, 0.063W, 1%, S0603

10K

1

MULTICOMP PRO

MCWR06X1002FTL

25

R3, R7

RES, SMD, 1R, 0.250W, 1%, S0603, ANTI SURGE

1R

2

ROHM

ESR03EZPJ1R0

26

R4, R8

RES, SMD, 0R0, 0.063W, 1%, S0402

0R

2

YAGEO

RC0402JR-070RL

27

R6, R9

RES, SMD, 49R9, 0.063W, 1%, S0402

49R9

2

MULTICOMP PRO

MCWR04X49R9FTL

28

TP4

SHORTING LINK PTH 10.16MM

LINK

1

HARWIN

D3082-05

29

TP9, TP10

SMT Test Point Loop

TP_SMT_LOOP

2

HARWIN

S2751-46R

30

TVS1

15.6V TVS SOD123

PTVS15VS1UR

1

NEXPERIA

PTVS15VS1UR,115

 

Table 1: Bill of materials

 

Ordering information

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Disclaimer

Heyday Integrated Circuits (“Heyday”) provides all data in any resource and in any format such as, but not limited to datasheets, reference designs, application notes, web tools and safety information “as is” and with all faults, and disclaims any type of warranties, fitness for a particular purpose or non-infringement of 3rd party intellectual property rights. Any examples described herein are for illustrative purposes only and are intended to provide customers with the latest, accurate, and in-depth documentation regarding Heyday products and their potential applications. These resources are subject to change without notice. Heyday allows you to use these resources only for development of an application that uses the Heyday product(s) described in the resource. Other reproduction and display of these resources is prohibited. Heyday shall have no liability for the consequences of use of the information supplied herein.

 

 

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