USERS' GUIDE
HD-000335-UG-1- HB-Bipolar-DS-eval-board
HEY-HBDS-G-12K1-A USERS'GUIDE
HEY1011 HALF BRIDGE BIPOLAR DRIVER SWITCH BOARD
Content
Description - Quick Start Guide - Default Settings - Gate pull up and pull down resistors - 3V3 LDO For Logic Circuits - HEY1011-L12 Under Voltage Lockout - Input PWM Circuit - Enable and start sequence - Measurement points - Bipolar Gate drive - Propagation delay - Double Pulse Test - Double pulse test results - Schematic - PCB Layout - Bill of materials - Ordering Information - Disclaimer
Description
The Heyday Integrated Circuits Half Bridge Driver-Switch HEY-HBDS-G-12D1-D is a demonstration board containing two HEY1011-L12 GaN FET drivers and two GaN FETs configured in a half bridge configuration.
The datasheet for the HEY1011-L12 used in this board can be found here.

Figure 1: HEY-HBDS-G-12K1-A Evaluation Board
The HEY-HBDS-G-12D1-D can be used to perform double pulse tests, or to interface the half bridge to an existing LC power section, both as shown below.
The isolated HEY1011-L12 driver does not require secondary side power or bootstrap components. Gate drive power is supplied to secondary side from the primary side supply voltage VDRV. The amplitude of the gate drive can be varied by varying VDRV between 7 V and 13.2 V.
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DANGER DO NOT TOUCH THE BOARD WHEN IT IS ENERGIZED AND ALLOW ALL COMPONENTS TO DISCHARGE COMPLETELY PRIOR HANDLING THE BOARD. HIGH VOLTAGE CAN BE EXPOSED ON THE BOARD WHEN IT IS CONNECTED TO POWER SOURCE. EVEN BRIEF CONTACT DURING OPERATION MAY RESULT IN SEVERE INJURY OR DEATH. Please ensure that appropriate safety procedures are followed. This evaluation kit is designed for engineering evaluation in a controlled lab environment and should be handled by qualified personnel ONLY. Never leave the board operating unattended. |
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WARNING Some components can be hot during and after operation. There is NO built-in electrical or thermal protection on this evaluation kit. The operating voltage, current, and component temperature should be monitored closely during operation to prevent device damage. |
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CAUTION This product contains parts that are susceptible to damage by electrostatic discharge (ESD). Always follow ESD prevention procedures when handling the product. |
Quick Start Guide

Figure 2: HEY-HBDS-G-12K1-A Quick Start
- Ensure the drivers are enabled. See section Enable and start sequence for details.
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Apply VDRV = 12V
- Apply input gate signals, with adequate dead time, to the IN_L and IN_H inputs. See section Input PWM circuit below for details.
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Convenient test points a located on the test board – see section Measurement points. A suitable differential oscilloscope should be used to monitor the high side gate signal from VGH to VSW.
Default Settings
The HEY-HBDS-G-12K1-A EVM is supplied with the following default settings:
Value | Default | Comment |
Gate resistors | RPU = 10 R, RPD = 1R | See section Gate pull up and pull down resistors |
SEL | UVLO = 10 V | See section Hey1011-L12 Under Voltage Lockout |
EN | Pull up to VDRV | See section Enable and start sequence |
PWM IN | HS_EXT, LS_EXT | See section Input PWM circuit |
VDD_LOGIC | External supply | See section 3V3 LDO for logic circuit |
Gate pull up and pull down resistors
The HEY1011-L12 gate driver has independent output pins for the gate pull up and gate pull down allowing control of the turn-on and turn-off rise and fall times.
The default values for these resistors are:
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OUTPU: R1 and R5 = 10 Ohms
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OUTPD: R3 and R7 = 1 Ohm
These values can be modified to suit your own application.
3V3 LDO for logic circuits
The HEY-HBDS-G-12K1-A EVM contains an on-board LDO regulator to generate a 3.3 V. This 3V3 supply is used for the deadtime circuit and can also be used for EN pull up.
The input supply, VDD_LOGIC, is supplied through pin 2 of connector CONN1. This can be a separate external DC supply or can be linked to the driver supply, VDRV, at CONN1
Figure 3: 3V3 LDO Circuit
HEY1011-L12 Under Voltage Lockout
The SEL pin of the HEY1011-L12 drivers selects the under-voltage lock-out level for the VDRV supply. This is done by connecting the SEL pin to GND or VDRV to select the desired nominal UVLO level. Tying SEL pin to GND selects the UVLO = 6.6V while tying SEL pin to VDRV selects the UVLO = 10V (the default setting on the HEY-HBDS-G-12K1-A EVM).
Figure 4:HEY1011-L12 UVLO Setting
Input PWM Circuit
The HEY-HBDS-G-12K1-A EVM contains an on-board circuit to generate a deadtime between the high side and low side gate drive signals from a single external signal generator.
This option is selected by setting the connector CONN8 jumpers to HS_INT and LS_INT. The deadtime between the high side and low side can be adjusted with the variable resistors R16 and R17 and the minimum deadtime is set with resistors R18 and R19.
Alternatively, the input PWM signals can be supplied externally direct from two signal generator channels and the internal deadtime circuit is bypassed by selecting HS_EXT and LS_EXT on connector CONN8.
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Figure 5: Input signal deadtime circuit
Enable and start sequence
The HEY1011-L12 has an open drain enable pin (EN) to facilitate a system level wired-AND start up.
When the enable pin is externally pulled low this forces the driver into a low power mode. The driver output is pulled low in this mode. In the event of an internal fault condition, such as UVLO, this pin is actively pulled low internally by the driver. During normal operation, the pin is released by the driver, and must be pulled up with an external pull-up resistor. This functionality can be used by the PWM controller as an indication that it can start sending IN pulses to the driver. It is typically wired AND with the controller enable pin as shown in Figure 7 below.
The HEY-HBDS-G-12K1-A EVM board provides direct access to the EN pin on connector CONN1.
The EVM also contains, on connector CONN 5, options for pulling the EN pin to VDRV, an internal 3.3 V or an external EN_PU supply rail on CONN1. The EN_PU option can be used to use an external DC source or external system voltage, to pull up the EN pin.
The fourth option on connector CONN5 ties EN to GND and disables both drivers
Figure 6: Enable pull up options
Internally the board contains a 10k pull up resistor connected to the EN pin. If the EN pin is left floating, the drivers will not respond to INL or INH input signals.
Figure 7: HEY1011-L12 Wired-AND enable
The start up sequence of the HEY1011-L12 is shown in Figure 8 below. Time TSTART is defined as the time after which VDRV reaches the UVLO rising level to the HEY1011-L12 releasing the EN internal pull down.
IMPORTANT the IN signal must not be applied before the EN pin has been released.
Figure 8: HEY1011-L12 Start up sequence.
Typical Enable/Disable
When disabling the HEY1011, the output gate drive is terminated synchronous to the EN signal falling edge as shown in Figure 9 (left) below.
When the driver is enabled, the output gate is synchronous to the first rising edge of the IN signal that occurs after the secondary VSEC UVLO level is reached as shown in Figure 9 (right) below.
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CH1 (Red): Enable CH2 (Grn): Low side switch VGS CH3 (Blk): PWM Input |
CH1 (Red): Enable CH2 (Grn): Low side switch VGS CH3 (Blk): PWM Input |
Disable | Enable |
Figure 9: Typical Driver disable and enable
Measurement points
The HEY-HBDS-G-12K1-A EVM contains convenient test points for monitoring the high and low side gate drives as well as the switch node as shown in Figure 10 below.
When measuring VGS_H use a differential probe with suitable ratings for the applied bus voltage. The HEY-HBDS-G-12K1-A EVM uses a bipolar gate drive arrangement as shown in Bipolar Gate Drive below. When measuring VGS, both gate drives are measured relative to the source of their associated GaN FET. Therefore, the off-state voltage will be negative. See section Bipolar Gate Drive for further details.
It is important to use a low inductance scope probe ground lead as shown to avoid pickup of spurious switching noise.
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Figure 10: Measurement points
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CAUTION: Many of the test signals have different reference voltages. It is important that these are not short circuited through the oscilloscope ground leads or external test equipment |
Bipolar Gate Drive
Due to the high rate of change of voltages and currents in power switching circuits, unwanted inductor currents and capacitor voltage drops can be created.
One such example is the false turn on of a FET due to a dv/dt event. In a half bridge circuit, after the low side FET has been turned off and a suitable dead-time elapsed, the high side FET is turned on. This produces a rapidly changing switch node voltage at the drain of the low side FET. This voltage will produce a capacitor current:
flowing in the gate-drain capacitance, CGD, and driver output. It will cause the voltage on the gate of the low side FET to rise. If this voltage spike peaks beyond the threshold voltage VTH, the FET will conduct. Considering that the high side FET is also conducting, this can result in a potentially destructive shoot-through event.
The HEY-HBDS-G-12K1-A EVM uses a bipolar gate drive arrangement which is useful to mitigate against the effects of gate-drain capacitor currents. The secondary supply voltage VSEC is a function of the primary supply voltage VDRV. The zener diode, CR1, will regulate the positive turn on voltage of the GaN FET. During the turn-off of period, the gate voltage will be negative with a value of:
VGS_OFF = VSEC – VZENER. VSEC is typically 8 V when VDRV = 12 V and CLOAD = 1 nF.
This negative VGS_OFF voltage allows more margin before the threshold voltage can be reached.
Figure 11: Bi-polar gate drive schematic
Propagation Delay
- VDRV = 12V
- Input = 100kHz
- RPU = 10R, RPD = 1R
- Power train un-loaded. That is, VHV+ = 0V.
Low side driver output |
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CH1 (Red): Low side driver input |
Typical Turn-on Propagation Delay |
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CH1 (Red): Low side driver input |
Typical Turn-off Propagation Delay |
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CH1 (Red): Low side driver input |
Figure 12: Typical Driver output at 100kHz
Double Pulse Test
The double pulse test is used to evaluate the switching characteristics of a power switch under hard switching but in a safe manner.
For a low side switch the set up is as shown below:

Figure 13: Double Pulse Test
The low side switch is driven with two pulses as shown below. The high side switch can be held off or driven with the inverse of the low side gate switch (with adequate dead time).

Figure 14: Double Pulse Test Waveforms
An inductor is placed in parallel with the high side switch. The goal of this inductor is to establish the test level current in the low side switch at the end of the first on pulse (1). The magnitude of the test level current at the end of period 1 is given by:
During period 2, the inductor current will naturally decay. The duration of period 2 should not be too long that inductor current deviates significantly from the desired test level.
During period 3, the inductor current will again rise. Period 3 should not be so long that the inductor current rises to an excessive level.
The falling edge of pulse 1 is used to examine the hard turn off characteristics of the switch. The rising edge of pulse 3 is used to examine the hard turn on characteristics of the switch. By only applying these two pulses, the switches are only on for a very short time and should not overheat.
Double Pulse Test Results
COMPONENTS |
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Drivers: |
Heyday HEY1011-L12 |
Inductor: |
100uH Air Core |
RPU: |
10Ω |
RPD: |
1Ω |
DPT Result 100V – 10A
DPT Overview |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard turn off |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard turn on |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Figure 15: DPT 100V – 10A |
DPT Result 200V – 19A
DPT Overview |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard turn off |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard turn on |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Figure 16: DPT 200V – 19A |
DPT Result 450V – 58A
DPT Overview |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard Turn Off |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Hard Turn On |
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CH2 (Grn): Low side Vgs (1GHz BW) |
Figure 17: DPT 450V – 58A |
Bill of materials
Item |
Ref Name |
Description |
Value |
Qty |
Manufacturer |
Manufacturer PN |
1 |
C1, C2 |
CAP CERALINK, 1uF,500V PLZT |
1uF |
2 |
TDK |
B58031U5105M062 |
2 |
C11, C12,C21,C22 |
CAP, CER,0.1uF,25V, X7R, S0603 |
0.1uF |
4 |
KEMET |
C0603C104K3RACTU |
3 |
C14,C15,C16,C17 |
CAP, CER,100nF,16V,X7R, S0402 |
100nF |
4 |
KEMET |
C0402C104K4RALTU |
4 |
C18,C19,C20,C23 |
CAP, CER,1uF,16V, X7R, S0603 |
1uF |
4 |
WURTH ELEKTRONIK |
885012206052 |
3 |
C3,C4 |
CAP, CER, 75pF,50V, NP0, S0402 |
75pF |
2 |
MULTICOMP PRO |
MC0402N750J500CT |
6 |
C5,C7 |
CAP 2.2uF 630V PP FILM C12X26 |
2.2uF |
2 |
PANASONIC |
ECWFE2J225K |
7 |
C6,C13 |
CAP, CER,1uF,25V, X5R, S0402 |
1uF |
2 |
MURATA |
GRM155R61E105KA12D |
8 |
C9, C10 |
CAP, CER, 820pF,50V, X7R, S0603 |
820pF |
2 |
MULTICOMP PRO |
MC0603B821K500CT |
9 |
CONN1 |
CONN, SCREW TERM, 5WAY |
5WAY, SCREW TERM |
1 |
PHOENIX CONTACT |
MPT 0,5/ 5-2,54 |
10 |
CONN2, CONN3, CONN4 |
CONN, PWR, M5, PTH |
M5 SCREW TERM |
3 |
KEYSTONE |
7808 |
11 |
CONN6 |
CONN, HDR, 2WAY, 2P54 |
HDR, 2Way, 2.54mm |
1 |
HARWIN |
M20-9730246 |
12 |
CONN7, CONN9 |
SMA CONNECTOR EDGE (1.6mm PCB) |
SMA EDGE |
2 |
AMPHENOL RF |
132322 |
13 |
CONN8, CONN5 |
CONN, HDR, 8WAY, 2P54 |
8WAY, 2P54, VERT |
2 |
HARWIN |
M20-9980446 |
14 |
CR1,CR2 |
DIO ZEN, 6V2, 100mW, 2%, SOD923 |
CDZVT2R6.2B |
2 |
ROHM |
CDZVT2R6.2B |
15 |
IC1,IC2 |
HEY1011 7.66 X10 MODULE |
HEY1011-L12 |
2 |
HEYDAY IC |
HEY1011-L12 |
16 |
IC3,IC4,IC5,IC6 |
IC, 2 INPUT XOR, SC70, NC7SV86 |
NC7SV86 |
4 |
ON SEMI |
NC7SV86P5X |
17 |
IC7 |
MCP1799, 5V, 80mA LDO SOT23 |
MIC5203 3V3 80mA LDO |
1 |
MICROCHIP |
MIC5203-3.3YM5-TR |
18 |
Q1,Q2 |
NGAN GS66516B 650V 60A |
GS66516B |
2 |
GAN SYSTEMS |
GS66516B-MR |
19 |
R1,R5 |
RES, SMD, 10R, 0.250W, 1%, S0603, ANTI SURGE |
10R |
2 |
BOURNS |
CMP0603AFX-10R0ELF |
20 |
R10, R12 |
RES, SMD, NA, 1%, S0402 |
NA |
2 |
|
|
21 |
R11, R13 |
RES, SMD, 3K6, 0.063W, 1%, S0402 |
3.6K |
2 |
TE CONNECTIVITY |
CRG0402F3K6 |
22 |
R14, R15,R18,R19 |
RES, SMD, 100R, 0.063W, 1%, S0603 |
100R |
4 |
MULTICOMP PRO |
MCWR06X101 JTL |
23 |
R16, R17 |
RES_VAR, 1K, SMT, 5mm, 1Turn |
1K |
2 |
VISHAY |
TS53YJ102MR10 |
24 |
R2 |
RES, SMD, 10K, 0.063W, 1%, S0603 |
10K |
1 |
MULTICOMP PRO |
MCWR06X1002FTL |
25 |
R3, R7 |
RES, SMD, 1R, 0.250W, 1%, S0603, ANTI SURGE |
1R |
2 |
ROHM |
ESR03EZPJ1R0 |
26 |
R4, R8 |
RES, SMD, 0R0, 0.063W, 1%, S0402 |
0R |
2 |
YAGEO |
RC0402JR-070RL |
27 |
R6, R9 |
RES, SMD, 49R9, 0.063W, 1%, S0402 |
49R9 |
2 |
MULTICOMP PRO |
MCWR04X49R9FTL |
28 |
TP4 |
SHORTING LINK PTH 10.16MM |
LINK |
1 |
HARWIN |
D3082-05 |
29 |
TP9, TP10 |
SMT Test Point Loop |
TP_SMT_LOOP |
2 |
HARWIN |
S2751-46R |
30 |
TVS1 |
15.6V TVS SOD123 |
PTVS15VS1UR |
1 |
NEXPERIA |
PTVS15VS1UR,115 |
Table 1: Bill of materials
Ordering information
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Disclaimer
Heyday Integrated Circuits (“Heyday”) provides all data in any resource and in any format such as, but not limited to datasheets, reference designs, application notes, web tools and safety information “as is” and with all faults, and disclaims any type of warranties, fitness for a particular purpose or non-infringement of 3rd party intellectual property rights. Any examples described herein are for illustrative purposes only and are intended to provide customers with the latest, accurate, and in-depth documentation regarding Heyday products and their potential applications. These resources are subject to change without notice. Heyday allows you to use these resources only for development of an application that uses the Heyday product(s) described in the resource. Other reproduction and display of these resources is prohibited. Heyday shall have no liability for the consequences of use of the information supplied herein.